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| | Tuesday, June 11, 2002, 4:30 PM - 6:00 PM | Room: Auditorium A
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SESSION 12
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| | PANEL: Analog Intellectual Property: Now? or Never?
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| | Chair: Stephen Ohr - EET/CMP Media, San Francisco, CA
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| | Organizers: Linda Marchant, Philippe Magarshack
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| | With more and more Systems-on-chip makers hoping to include analog functional blocks as a means of differentiating their designs, it is therefore tempting to believe that analog intellectual properties (IP) can be created, traded and integrated with the same tools and methodologies with which digital IP are moved about. But is analog IP a viable business? Can analog IPs be traded — given that design tuning is needed for every new chip variant, and every new process generation? Certainly, silicon foundries need to rely on a wide set of external IP offerings, in order to allow their users to build complete systems. Are they seeing enough activity in Analog IP designs to justify specialized fab runs, or the kind of process tuning that would allow analog and digital IPs to coexist on the same chip? What is the future of analog designs at the very low voltage-swings coming with sub-100nm CMOS? What CAD tools are needed to help analog designers? Are newly emerging EDA technologies, designed to enhance analog design productivity, maturing rapidly enough to be accepted by designers? Certainly many Analog IP providers and Analog EDA tool vendors would argue that the answer is yes. However, how many 'traditional' analog designers would admit they are still using kit parts and breadboards — maybe Spice and manual IC layout techniques — today in their every-day job?
This panel of experts — representing analog designers, analog EDA tool providers, silicon foundries and analog IP vendors — will address these issues, and provide a likely context for analog IP development and trade.
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| |  12.1 |
Analog Intellectual Property: Now? or Never?
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| | | Speaker(s): | Roy McGuffin - Antrim Design Systems, Inc., Scotts Valley, CA
Felicia James - Cadence Design Systems, Inc., San Jose, CA
Rudolf Koch - Infineon Technologies AG, Munich, Germany
Masao Hotta - Hitachi Ltd., Gunma-ken, Japan
Mike Brunolli - Nurlogic Design, Inc., San Diego, CA
Andrew Moore - TSMC, San Jose, CA
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